Manhattan ICPU-GREESE

Thermal paste for CPU

The thermal paste helps create maximum conductivity between the microprocessor and the CPU heatsink to reduce the risks of overheating. Specially designed to reliably and easily cover construction imperfections and to close critical gaps that can reduce cooling efficiency and increase potential damage.

• Thermal conductivity: > 0.965 W / MK
• Thermal resistance:
• Color: Gray
• Dielectric constant A: > 5.1
• Thixotropic index: 380 ± 10 1/10 mm
• Operating temperature: -30 ~ 180 ° C
• Composition: Silicone, 50%
• Composition: Carbon, 20%
• Compound: Metal oxide, 30%
• Packaging dimensions: (LxWxH) 11.5 X 4.5 X 1.5 cm
• Packaging weight: 0.0150 Kg

Package Contents

• 1x Manhattan ICPU-GREESE - Thermal paste for CPU