The QIANLI MEGA-IDEA iShuriken tin scraper knife for solder paste, version A, is a tool designed for removing excess solder paste and other materials during electronic device repairs, especially in mobile phones. It features an ultra-thin 0.2 mm blade that allows precise work and is suitable for removing glue and glue residues. The ergonomic design ensures comfortable use during extended repair sessions.

• Ultra-thin blade: The 0.2 mm blade is designed for precise and delicate work.
• Ergonomic design: The tool is designed for comfortable and fatigue-free use.
• Versatile use: Can be used to remove solder paste and glue residues from mobile phones and other electronic devices.
• Durable construction: Made from high-quality materials, it withstands frequent use.
• Safe and reliable: Designed with safety in mind, ensuring the protection of sensitive components.