1. General maintenance component for mobile phones, rotational stable design, no rebound, securely fastened.

2. Prevent clamp movement during use, special non-slip pad.

3. Allow hot air to be evacuated more effectively, add a cooling plate to the bottom of the clamp.

4. The rotating shaft locks the motherboard or IC more effectively, firmly secured without rebound.

5. The fixtures also support IC type components that are secured for removing the back glue, the clamp is designed to withstand the force of the IC bundle, avoiding IC breakage during the removal of black glue.

6. The component can be adjusted to different distances from high, medium, and low levels. It is necessary to loosen the two screws at the bottom, move the mounting plate to the appropriate speed position, and then tighten the bottom screws to lock it.

7. Protect the upper and lower layers of the dual-layer motherboard during maintenance.

8. Suitable for mobile phone motherboards of various sizes and shapes.

9. Suitable for securing during the cleaning of large chips such as CPU and NAND.