The high-performance thermal paste DeepCool EX750 is designed for extremely low thermal resistance that maximizes heat transfer and dissipation for high-performance CPU and GPU components (desktop/laptop).
Easy and safe application: The smooth consistency facilitates application and helps fill every microchannel between surfaces, ensuring excellent thermal conductivity.
- Weight: 3g
- Density: 2.6 g/cm3
- Operating temperature: from -50°C to 250°C
- Thermal conductivity: 6.2 W/mK
- Series: EX750
- Quantity
- 3 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.